CV
General Information
Full Name | Jianshu Liu (刘鉴庶) |
Label | Systems Researcher |
Language | English, Mandarin |
Research Interests | Distributed System, Cloud Computing, Microservices, Stream Processing System, ML4Sys |
Education
-
2018 - 2024 Doctor of Philosophy (Ph.D.) - Computer Science
Louisiana State University, Baton Rouge, LA, United States - Dissertation: Designing and Optimizing Soft Resource Adaptation for Modern Cloud Systems in Data Centers
- Advisor: Dr. Qingyang Wang
-
2014 - 2018 Bachelor of Engineering (B.Eng.) - Electronics Engineering
Beijing University of Posts and Tele., Beijing, China
Experience
-
Jul 2024 - May 2025 Tenure-track Assistant Professor
Boise State University, Boise, ID, Unitied States - Mentor: Dr. Amit Jain
-
May 2023 - Aug 2023 Summer Research Intern
University of Chicago, Chicago, IL, United States - Mentor: Dr. Kyle Chard
-
Aug 2018 - May 2024 Research Asssitant
Louisiana State University, Baton Rouge, LA, United States - Advisor: Dr. Qingyang Wang
-
Mar 2018 - May 2018 Intern in Cloud Computing
China Telecom Corportation Limited Beijing Research Institute, Beijing, China - Mentor: Dr. Xuliang Wang
Honors and Awards
-
2024 - Championship in Beginner Level in the 1st Boise State CS Ping-pong Tournament
- LSU 5th EECS Symposium Meritorious Awards
-
2023 - Best Paper Award in the 24th International Middleware Conference (Middleware'23)
- Student Scholarships in the 14th Symposium on Cloud Computing (SoCC'23)
-
2017 - Honorable Mention in Mathematical Contest in Modeling
Professional Services
-
Program Committee
- TPC Member in AI/ML for Cloud and IoT Track, IEEE CloudSummit 2025
- PC Member in System Software Track, IPDPS 2025
- Shadow PC Member, EuroSys 2023
-
Journal Reviewer
- ACM Transactions on Internet Technoglogy (TOIT), 2025
- IEEE Transactions on Parallel and Distributed Systems (TPDS), 2022, 2023, 2024
- IEEE Transactions on Information Forensics and Security (TIFS), 2024
- IEEE Transactions on Mobile Computing (TMC), 2024
- IEEE Transactions on Automation Science and Engineering (TASE), 2024
- IEEE Transactions on Cloud Computing (TCC), 2019, 2020